董事介绍
注：董事持股数取自最新公司公告
| 姓名 | 性别 | 职位 | 年龄 | 薪酬 | 持股数(万股) | 截止日期 |
|---|---|---|---|---|---|---|
| Susan L. Spradley | 女 | Director | 65 | 30.99万美元 | 0.95 | 2026-08-11 |
| Alan S. Lowe | 男 | Director | 64 | 32.00万美元 | 0.24 | 2026-08-11 |
| Richard Clemmer | 男 | Director | 74 | 36.86万美元 | 0.16 | 2026-08-11 |
| Christopher R. Koopmans | 男 | Director | 49 | 36.86万美元 | 未持股 | 2026-08-11 |
| Peter Feld | 男 | Director | 47 | 26.14万美元 | 未持股 | 2026-08-11 |
| Judy Bruner | 女 | Director | 67 | 35.00万美元 | 0.77 | 2026-08-11 |
| Walden C. Rhines | 男 | Chair of the Board | 79 | 42.75万美元 | 9.91 | 2026-08-11 |
| Robert A. Bruggeworth | 男 | Chief Executive Officer and Director and President | 65 | 1355.16万美元 | 14.77 | 2026-08-11 |
| John R. Harding | 男 | Director | 71 | 32.48万美元 | 0.55 | 2026-08-11 |
| Roderick D. Nelson | 男 | Director | 66 | 32.91万美元 | 0.77 | 2026-08-11 |
高管介绍
注：高管持股数取自最新公司公告
| 姓名 | 性别 | 职位 | 年龄 | 薪酬 | 持股数(万股) | 截止日期 |
|---|---|---|---|---|---|---|
| Gina B. Harrison | 女 | Corporate Controller and Vice President | 58 | 76.94万美元 | 未持股 | 2026-08-11 |
| Paul J. Fego | 男 | Senior Vice President of Global Operations | 69 | 386.76万美元 | 2.83 | 2026-08-11 |
| Grant A. Brown | 男 | Chief Financial Officer and Senior Vice President | 49 | 425.12万美元 | 0.08 | 2026-08-11 |
| Philip J. Chesley | 男 | President of High Performance Analog and Senior Vice President | 55 | 302.29万美元 | 0.13 | 2026-08-11 |
| Frank P. Stewart | 男 | President of Advanced Cellular and Senior Vice President | 52 | 未披露 | 未持股 | 2026-08-11 |
| Robert A. Bruggeworth | 男 | Chief Executive Officer and Director and President | 65 | 1355.16万美元 | 14.77 | 2026-08-11 |
| Steven E. Creviston | 男 | President of Connectivity & Sensors and Senior Vice President | 62 | 347.83万美元 | 8.24 | 2026-08-11 |
董事简历
中英对照 | 中文 | 英文- Susan L. Spradley
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Susan L. Spradley，她曾担任公司的董事（2017年1月以来）。她目前是Spradley Consulting LLC（她创建于2017年2月的咨询公司）的负责人。从2013年1月到2017年1月，她曾担任Viavi Solutions Inc.（原为JDS Uniphase）的多种职务，最近担任执行副总裁兼总经理，负责网络和服务支持。加入Viavi Solutions Inc.之前，她曾担任US-Ignite的执行董事（2011年4月至2012年12月）。此前，她曾担任Nokia Siemens Networks的北美地区总裁（2007年至2011年），负责区域利润和损失、销售和服务。她曾担任Nortel Networks Corporation的执行职务（从1997年到2005年）。她也曾任职于EXFO Inc.（上市公司）的董事会（从2011年10月到2012年11月）。
Susan L. Spradley,has served on the Board of Directors since January 2017. She has served as a partner in TAP Growth Group, a senior executive consulting firm, since April 1, 2023. From January 2018 to September 2022, Ms. Spradley was the Chief Executive Officer of Motion Intelligence, a privately held software-as-a-service company. She was principal of Spradley Consulting LLC, a consulting firm that she founded, from February 2017 until January 2020, and a partner in TAP Growth Group, from August 2017 to June 2019. From January 2013 until January 2017, she served in various roles at Viavi Solutions Inc. (formerly JDS Uniphase), most recently as Executive Vice President and General Manager–Network and Service Enablement. Prior to joining Viavi Solutions Inc., Ms. Spradley served as executive director at US-Ignite from April 2011 to December 2012. Prior to that, Ms. Spradley was President of the North America region at Nokia Siemens Networks from 2007 to 2011, responsible for regional profit and loss, sales and service. From 1997 to 2005, she held executive positions at Nortel Networks Corporation. Ms. Spradley served on the board of directors of Avaya Holdings Corp., a publicly traded communications applications provider from December 2017 until her resignation in May 2023. Ms. Spradley also served as board member of NetScout Systems, Inc., a publicly traded real-time operational intelligence and performance analytics company, from April 2018 until August 2023. She previously served on the board of directors of publicly-traded EXFO Inc. from October 2011 through November 2012. Ms. Spradley is a board member of the nonprofit organization Catalyst Campus, focused on advancing start up technology for the U.S. Government. - Susan L. Spradley，她曾担任公司的董事（2017年1月以来）。她目前是Spradley Consulting LLC（她创建于2017年2月的咨询公司）的负责人。从2013年1月到2017年1月，她曾担任Viavi Solutions Inc.（原为JDS Uniphase）的多种职务，最近担任执行副总裁兼总经理，负责网络和服务支持。加入Viavi Solutions Inc.之前，她曾担任US-Ignite的执行董事（2011年4月至2012年12月）。此前，她曾担任Nokia Siemens Networks的北美地区总裁（2007年至2011年），负责区域利润和损失、销售和服务。她曾担任Nortel Networks Corporation的执行职务（从1997年到2005年）。她也曾任职于EXFO Inc.（上市公司）的董事会（从2011年10月到2012年11月）。
- Susan L. Spradley,has served on the Board of Directors since January 2017. She has served as a partner in TAP Growth Group, a senior executive consulting firm, since April 1, 2023. From January 2018 to September 2022, Ms. Spradley was the Chief Executive Officer of Motion Intelligence, a privately held software-as-a-service company. She was principal of Spradley Consulting LLC, a consulting firm that she founded, from February 2017 until January 2020, and a partner in TAP Growth Group, from August 2017 to June 2019. From January 2013 until January 2017, she served in various roles at Viavi Solutions Inc. (formerly JDS Uniphase), most recently as Executive Vice President and General Manager–Network and Service Enablement. Prior to joining Viavi Solutions Inc., Ms. Spradley served as executive director at US-Ignite from April 2011 to December 2012. Prior to that, Ms. Spradley was President of the North America region at Nokia Siemens Networks from 2007 to 2011, responsible for regional profit and loss, sales and service. From 1997 to 2005, she held executive positions at Nortel Networks Corporation. Ms. Spradley served on the board of directors of Avaya Holdings Corp., a publicly traded communications applications provider from December 2017 until her resignation in May 2023. Ms. Spradley also served as board member of NetScout Systems, Inc., a publicly traded real-time operational intelligence and performance analytics company, from April 2018 until August 2023. She previously served on the board of directors of publicly-traded EXFO Inc. from October 2011 through November 2012. Ms. Spradley is a board member of the nonprofit organization Catalyst Campus, focused on advancing start up technology for the U.S. Government.
- Alan S. Lowe
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Alan S. Lowe，自2015年起，Lowe先生担任Lumentum Holdings Inc.的总裁兼首席执行官，Lumentum Holdings Inc.是一家光学和光子产品的设计者和制造商，可在全球范围内实现光网络和激光应用。在Lumentum于2015年与Viavi Solutions Inc.分离之前，Lowe先生受雇于Viavi。Lowe先生于2007年9月加入Viavi，担任激光器业务高级副总裁，并于2008年10月成为Viavi通信和商业光学产品业务执行副总裁兼总裁。
Alan S. Lowe served as President and Chief Executive Officer of Lumentum Holdings Inc., a leading global manufacturer of optical and photonic products to end markets including artificial intelligence, cloud computing, telecommunications, and industrial from July 2015 to February 2025. Prior to Lumentum's spin out from Viavi Solutions Inc. in 2015, Mr. Lowe served as Senior Vice President of Viavi's Commercial Lasers business beginning in 2007, and then as Viavi's Executive Vice President and President of its Communications and Commercial Optical Products business beginning in 2008. Prior to joining Viavi, Mr. Lowe was Senior Vice President, Customer Solutions Group, at Asyst Technologies, Inc., a leader in automating semiconductor and flat panel display fabs. Prior to that, he served as the President and Chief Executive Officer of Read Rite Corporation, a manufacturer of thin film recording heads for disk and tape drives. - Alan S. Lowe，自2015年起，Lowe先生担任Lumentum Holdings Inc.的总裁兼首席执行官，Lumentum Holdings Inc.是一家光学和光子产品的设计者和制造商，可在全球范围内实现光网络和激光应用。在Lumentum于2015年与Viavi Solutions Inc.分离之前，Lowe先生受雇于Viavi。Lowe先生于2007年9月加入Viavi，担任激光器业务高级副总裁，并于2008年10月成为Viavi通信和商业光学产品业务执行副总裁兼总裁。
- Alan S. Lowe served as President and Chief Executive Officer of Lumentum Holdings Inc., a leading global manufacturer of optical and photonic products to end markets including artificial intelligence, cloud computing, telecommunications, and industrial from July 2015 to February 2025. Prior to Lumentum's spin out from Viavi Solutions Inc. in 2015, Mr. Lowe served as Senior Vice President of Viavi's Commercial Lasers business beginning in 2007, and then as Viavi's Executive Vice President and President of its Communications and Commercial Optical Products business beginning in 2008. Prior to joining Viavi, Mr. Lowe was Senior Vice President, Customer Solutions Group, at Asyst Technologies, Inc., a leader in automating semiconductor and flat panel display fabs. Prior to that, he served as the President and Chief Executive Officer of Read Rite Corporation, a manufacturer of thin film recording heads for disk and tape drives.
- Richard Clemmer
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Richard Clemmer，自2025年4月起担任董事会成员。Clemmer先生是Socratic Partners的创始合伙人，该公司是一家投资于半导体行业的风险投资公司，曾担任全球技术首席执行官。最近，Clemmer先生于2009年至2020年5月担任半导体公司Nxp Semiconductors N.V.的首席执行官兼总裁。此前，他曾于2007年至2008年担任私募股权公司Kohlberg Kravis Roberts & Co.的高级顾问。他还曾于2005年至2007年担任集成电路组件公司杰尔系统公司的总裁兼首席执行官。在加入杰尔系统公司之前，Clemmer先生曾在德州仪器公司和Quantum Corporation担任多个行政领导职务。Clemmer先生自2020年2月起担任惠普 Inc.的董事会成员，并自2022年8月起担任希捷科技控股有限公司的董事会成员。克莱默先生还在多个私营和非营利董事会任职。Clemmer先生此前曾在Aptiv PLC、Nxp Semiconductors N.V.和NCR Corporation的董事会任职。
Richard Clemmer,has served on the Board of Directors since April 2025. Mr. Clemmer is the founding partner of Socratic Partners, a venture capital firm that invests in the semiconductor industry, and has served as a global technology Chief Executive Officer. Most recently, Mr. Clemmer served as the Chief Executive Officer and President of NXP Semiconductors N.V., a semiconductor company, from 2009 to May 2020. Previously, he was a senior advisor to Kohlberg Kravis Roberts & Co., a private equity firm, from 2007 to 2008. He also served as President and Chief Executive Officer of Agere Systems Inc., an integrated circuits components company, from 2005 to 2007. Prior to joining Agere Systems, Mr. Clemmer held a number of executive leadership positions at Texas Instruments, Inc. and Quantum Corporation. Mr. Clemmer has served on the board of directors of HP Inc. since February 2020, and Seagate Technology Holdings plc since August 2022. Mr. Clemmer also serves on multiple private and non-profit boards. Mr. Clemmer previously served on the board of directors of Aptiv PLC, NXP Semiconductors N.V. and NCR Corporation. - Richard Clemmer，自2025年4月起担任董事会成员。Clemmer先生是Socratic Partners的创始合伙人，该公司是一家投资于半导体行业的风险投资公司，曾担任全球技术首席执行官。最近，Clemmer先生于2009年至2020年5月担任半导体公司Nxp Semiconductors N.V.的首席执行官兼总裁。此前，他曾于2007年至2008年担任私募股权公司Kohlberg Kravis Roberts & Co.的高级顾问。他还曾于2005年至2007年担任集成电路组件公司杰尔系统公司的总裁兼首席执行官。在加入杰尔系统公司之前，Clemmer先生曾在德州仪器公司和Quantum Corporation担任多个行政领导职务。Clemmer先生自2020年2月起担任惠普 Inc.的董事会成员，并自2022年8月起担任希捷科技控股有限公司的董事会成员。克莱默先生还在多个私营和非营利董事会任职。Clemmer先生此前曾在Aptiv PLC、Nxp Semiconductors N.V.和NCR Corporation的董事会任职。
- Richard Clemmer,has served on the Board of Directors since April 2025. Mr. Clemmer is the founding partner of Socratic Partners, a venture capital firm that invests in the semiconductor industry, and has served as a global technology Chief Executive Officer. Most recently, Mr. Clemmer served as the Chief Executive Officer and President of NXP Semiconductors N.V., a semiconductor company, from 2009 to May 2020. Previously, he was a senior advisor to Kohlberg Kravis Roberts & Co., a private equity firm, from 2007 to 2008. He also served as President and Chief Executive Officer of Agere Systems Inc., an integrated circuits components company, from 2005 to 2007. Prior to joining Agere Systems, Mr. Clemmer held a number of executive leadership positions at Texas Instruments, Inc. and Quantum Corporation. Mr. Clemmer has served on the board of directors of HP Inc. since February 2020, and Seagate Technology Holdings plc since August 2022. Mr. Clemmer also serves on multiple private and non-profit boards. Mr. Clemmer previously served on the board of directors of Aptiv PLC, NXP Semiconductors N.V. and NCR Corporation.
- Christopher R. Koopmans
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Christopher R. Koopmans自2025年4月起担任董事会成员。自2025年7月起，Koopmans先生在上市半导体公司Marvell Technology, Inc.担任总裁兼首席运营官，领导公司的全球业务运营，确保成功执行战略目标，同时塑造长期增长战略。在成为总裁兼首席运营官之前，Koopmans先生担任过多种高级管理职务，包括2021年至2024年担任首席运营官，2019年至2021年担任营销和业务运营执行副总裁，2018年至2019年担任业务运营执行副总裁。在2016年加入Marvell之前，Koopmans先生曾担任思杰系统副总裁兼服务提供商平台总经理。Koopmans先生于2012年通过收购Bytemobile加入Citrix，这是他共同创立的一家公司，他曾担任该公司的首席运营官。Koopmans先生在伊利诺伊大学以最高荣誉获得计算机工程理学学士学位，并在美国国家科学基金会研究生研究奖学金下在伊利诺伊大学担任电气和计算机工程博士研究生。他目前担任伊利诺伊大学Grainger工程学院的访客委员会成员。
Christopher R. Koopmans has served on the Board of Directors since April 2025. Since July 2025, Mr. Koopmans has served as President and Chief Operating Officer at Marvell Technology, Inc., a publicly traded semiconductor company, where he leads the company's global business operations, ensuring the successful execution of its strategic goals while shaping its long term growth strategy. Prior to becoming President and Chief Operating Officer, Mr. Koopmans served in a variety of senior management roles, including as Chief Operations Officer from 2021 to 2024, Executive Vice President of Marketing and Business Operations from 2019 to 2021, and Executive Vice President of Business Operations from 2018 to 2019. Prior to joining Marvell in 2016, Mr. Koopmans served as Vice President and General Manager of Service Provider Platforms at Citrix Systems. Mr. Koopmans joined Citrix with the acquisition of Bytemobile in 2012, a company he co founded and for which he served as Chief Operating Officer. Mr. Koopmans earned a Bachelor of Science degree in Computer Engineering with Highest Honors from the University of Illinois and spent time as a Ph.D. Student in Electrical and Computer Engineering at the University of Illinois under a National Science Foundation Graduate Research Fellowship. He currently serves on the board of visitors at the Grainger College of Engineering at the University of Illinois. - Christopher R. Koopmans自2025年4月起担任董事会成员。自2025年7月起，Koopmans先生在上市半导体公司Marvell Technology, Inc.担任总裁兼首席运营官，领导公司的全球业务运营，确保成功执行战略目标，同时塑造长期增长战略。在成为总裁兼首席运营官之前，Koopmans先生担任过多种高级管理职务，包括2021年至2024年担任首席运营官，2019年至2021年担任营销和业务运营执行副总裁，2018年至2019年担任业务运营执行副总裁。在2016年加入Marvell之前，Koopmans先生曾担任思杰系统副总裁兼服务提供商平台总经理。Koopmans先生于2012年通过收购Bytemobile加入Citrix，这是他共同创立的一家公司，他曾担任该公司的首席运营官。Koopmans先生在伊利诺伊大学以最高荣誉获得计算机工程理学学士学位，并在美国国家科学基金会研究生研究奖学金下在伊利诺伊大学担任电气和计算机工程博士研究生。他目前担任伊利诺伊大学Grainger工程学院的访客委员会成员。
- Christopher R. Koopmans has served on the Board of Directors since April 2025. Since July 2025, Mr. Koopmans has served as President and Chief Operating Officer at Marvell Technology, Inc., a publicly traded semiconductor company, where he leads the company's global business operations, ensuring the successful execution of its strategic goals while shaping its long term growth strategy. Prior to becoming President and Chief Operating Officer, Mr. Koopmans served in a variety of senior management roles, including as Chief Operations Officer from 2021 to 2024, Executive Vice President of Marketing and Business Operations from 2019 to 2021, and Executive Vice President of Business Operations from 2018 to 2019. Prior to joining Marvell in 2016, Mr. Koopmans served as Vice President and General Manager of Service Provider Platforms at Citrix Systems. Mr. Koopmans joined Citrix with the acquisition of Bytemobile in 2012, a company he co founded and for which he served as Chief Operating Officer. Mr. Koopmans earned a Bachelor of Science degree in Computer Engineering with Highest Honors from the University of Illinois and spent time as a Ph.D. Student in Electrical and Computer Engineering at the University of Illinois under a National Science Foundation Graduate Research Fellowship. He currently serves on the board of visitors at the Grainger College of Engineering at the University of Illinois.
- Peter Feld
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Peter Feld，自2011年4月起担任Starboard Value LP的管理成员、投资组合经理和研究主管。在2005年2月加入Ramius之前，Feld先生是美国银行证券有限责任公司技术投资银行组的分析师。此前，他曾于2018年9月至2025年5月担任GenDigital Inc.的董事会成员，GenDigital Inc.是一家致力于通过其消费品牌家族为数字自由提供动力的全球领导者；2022年3月至2023年10月担任金融科技公司Green Dot Corporation；2020年6月至2022年9月被Compagnie de Saint-Gobain S.A.收购之前担任技术公司GCP Applied Technologies，Inc.的董事会成员；2019年3月至2022年1月被Centene Corporation收购之前担任医疗保健公司Magellan Health, Inc.；跨国基础设施公司AECOM，2019年11月至2020年6月；存储、网络和连接半导体解决方案公司Marvell Technology Group Ltd. 2016年5月至2018年6月；安全相关服务的全球领先企业布林克斯公司2016年1月至2017年11月；行业领先的人力资源服务提供商Insperity, Inc.公司2015年3月至2017年6月；全方位服务餐饮公司达登饭店公司公司2014年10月至2015年9月；领先的产品和技术授权公司Tessera Technologies, Inc.（n/k/a TERMXperi Corporation Xperi Corporation）2013年6月至2014年4月；以及Integrated Device Technology, Inc.公司，该公司设计、开发，2012年6月至2014年2月，为先进通信、计算和消费行业制造和销售一系列半导体解决方案。费尔德先生获得塔夫茨大学经济学学士学位。
Peter Feld,is a Managing Member, Portfolio Manager and Head of Research of Starboard Value LP since April 2011.Prior to joining Ramius in February 2005, Mr. Feld was an analyst in the Technology Investment Banking group at Banc of America Securities LLC. Previously, he served as a member of the boards of directors of Gen Digital Inc., a global leader dedicated to powering Digital Freedom through its family of consumer brands, from September 2018 to May 2025; Green Dot Corporation, a financial technology company, from March 2022 to October 2023; GCP Applied Technologies, Inc., a technology company, from June 2020 until it was acquired by Compagnie de Saint-Gobain S.A. in September 2022; Magellan Health, Inc., a healthcare company, from March 2019 until it was acquired by Centene Corporation in January 2022; AECOM, a multinational infrastructure firm, from November 2019 to June 2020; Marvell Technology Group Ltd., a storage, networking and connectivity semiconductor solutions company, from May 2016 to June 2018; The Brink's Company, a global leader in security-related services, from January 2016 to November 2017; Insperity, Inc., an industry-leading HR services provider, from March 2015 to June 2017; Darden Restaurants, Inc., a full-service restaurant company, from October 2014 to September 2015; Tessera Technologies, Inc. (n/k/a Xperi Corporation), a leading product and technology licensing company, from June 2013 to April 2014; and Integrated Device Technology, Inc., a company that designed, developed, manufactured and marketed a range of semiconductor solutions for the advanced communications, computing and consumer industries, from June 2012 to February 2014. Mr. Feld received a B.A. degree in Economics from Tufts University. - Peter Feld，自2011年4月起担任Starboard Value LP的管理成员、投资组合经理和研究主管。在2005年2月加入Ramius之前，Feld先生是美国银行证券有限责任公司技术投资银行组的分析师。此前，他曾于2018年9月至2025年5月担任GenDigital Inc.的董事会成员，GenDigital Inc.是一家致力于通过其消费品牌家族为数字自由提供动力的全球领导者；2022年3月至2023年10月担任金融科技公司Green Dot Corporation；2020年6月至2022年9月被Compagnie de Saint-Gobain S.A.收购之前担任技术公司GCP Applied Technologies，Inc.的董事会成员；2019年3月至2022年1月被Centene Corporation收购之前担任医疗保健公司Magellan Health, Inc.；跨国基础设施公司AECOM，2019年11月至2020年6月；存储、网络和连接半导体解决方案公司Marvell Technology Group Ltd. 2016年5月至2018年6月；安全相关服务的全球领先企业布林克斯公司2016年1月至2017年11月；行业领先的人力资源服务提供商Insperity, Inc.公司2015年3月至2017年6月；全方位服务餐饮公司达登饭店公司公司2014年10月至2015年9月；领先的产品和技术授权公司Tessera Technologies, Inc.（n/k/a TERMXperi Corporation Xperi Corporation）2013年6月至2014年4月；以及Integrated Device Technology, Inc.公司，该公司设计、开发，2012年6月至2014年2月，为先进通信、计算和消费行业制造和销售一系列半导体解决方案。费尔德先生获得塔夫茨大学经济学学士学位。
- Peter Feld,is a Managing Member, Portfolio Manager and Head of Research of Starboard Value LP since April 2011.Prior to joining Ramius in February 2005, Mr. Feld was an analyst in the Technology Investment Banking group at Banc of America Securities LLC. Previously, he served as a member of the boards of directors of Gen Digital Inc., a global leader dedicated to powering Digital Freedom through its family of consumer brands, from September 2018 to May 2025; Green Dot Corporation, a financial technology company, from March 2022 to October 2023; GCP Applied Technologies, Inc., a technology company, from June 2020 until it was acquired by Compagnie de Saint-Gobain S.A. in September 2022; Magellan Health, Inc., a healthcare company, from March 2019 until it was acquired by Centene Corporation in January 2022; AECOM, a multinational infrastructure firm, from November 2019 to June 2020; Marvell Technology Group Ltd., a storage, networking and connectivity semiconductor solutions company, from May 2016 to June 2018; The Brink's Company, a global leader in security-related services, from January 2016 to November 2017; Insperity, Inc., an industry-leading HR services provider, from March 2015 to June 2017; Darden Restaurants, Inc., a full-service restaurant company, from October 2014 to September 2015; Tessera Technologies, Inc. (n/k/a Xperi Corporation), a leading product and technology licensing company, from June 2013 to April 2014; and Integrated Device Technology, Inc., a company that designed, developed, manufactured and marketed a range of semiconductor solutions for the advanced communications, computing and consumer industries, from June 2012 to February 2014. Mr. Feld received a B.A. degree in Economics from Tufts University.
- Judy Bruner
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Judy Bruner，2009年1月以来曾担任董事。于2002年6月至2004年7月在SanDisk Corporation董事会任职。2004年6月以来，布鲁纳一直是美国晟碟公司的执行副总裁，首席财务官管理，一家闪存产品的供应商。从1999年9月到2004年6月，布鲁纳女士担任奔迈公司的高级副总裁兼首席财务官，一家手持计算和通信解决方案供应商。在加入奔迈之前，布鲁纳女士在3com公司，Ridge电脑公司和惠普公司担任财务管理职位。布鲁纳女士拥有洛杉矶加州大学经济学学士学位和圣克拉拉大学的工商管理硕士学位。
Judy Bruner has served on the Board of Directors since May 2021 and as Chair of the Audit Committee since November 2023. She served as the Executive Vice President, Administration and Chief Financial Officer of SanDisk Corp, a supplier of flash storage products, from June 2004 until its acquisition by Western Digital in May 2016. Ms. Bruner was Senior Vice President and Chief Financial Officer of Palm, Inc., a provider of handheld computing and communications solutions, from September 1999 until June 2004. Prior to that, she held financial management positions at 3Com Corporation, Ridge Computers and Hewlett Packard Company. Ms. Bruner has served as a member of the boards of directors of Applied Materials, Inc., a publicly traded semiconductor equipment manufacturer, since July 2016, Rapid7, Inc., a publicly traded security data and analytics solutions provider, since October 2016, and Seagate Technology Holdings plc, a publicly traded provider of storage solutions, from January 2018 until October 2025. She previously served on the boards of directors of Brocade Communications Systems, Inc. from January 2009 to November 2017 and Varian Medical Systems, Inc. from August 2016 to April 2021. - Judy Bruner，2009年1月以来曾担任董事。于2002年6月至2004年7月在SanDisk Corporation董事会任职。2004年6月以来，布鲁纳一直是美国晟碟公司的执行副总裁，首席财务官管理，一家闪存产品的供应商。从1999年9月到2004年6月，布鲁纳女士担任奔迈公司的高级副总裁兼首席财务官，一家手持计算和通信解决方案供应商。在加入奔迈之前，布鲁纳女士在3com公司，Ridge电脑公司和惠普公司担任财务管理职位。布鲁纳女士拥有洛杉矶加州大学经济学学士学位和圣克拉拉大学的工商管理硕士学位。
- Judy Bruner has served on the Board of Directors since May 2021 and as Chair of the Audit Committee since November 2023. She served as the Executive Vice President, Administration and Chief Financial Officer of SanDisk Corp, a supplier of flash storage products, from June 2004 until its acquisition by Western Digital in May 2016. Ms. Bruner was Senior Vice President and Chief Financial Officer of Palm, Inc., a provider of handheld computing and communications solutions, from September 1999 until June 2004. Prior to that, she held financial management positions at 3Com Corporation, Ridge Computers and Hewlett Packard Company. Ms. Bruner has served as a member of the boards of directors of Applied Materials, Inc., a publicly traded semiconductor equipment manufacturer, since July 2016, Rapid7, Inc., a publicly traded security data and analytics solutions provider, since October 2016, and Seagate Technology Holdings plc, a publicly traded provider of storage solutions, from January 2018 until October 2025. She previously served on the boards of directors of Brocade Communications Systems, Inc. from January 2009 to November 2017 and Varian Medical Systems, Inc. from August 2016 to April 2021.
- Walden C. Rhines
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Walden C. Rhines，2000年以来，担任本公司的董事长、首席执行官；1993-2000，担任本公司的总裁、首席执行官。他目前是半导体公司TriQuint Semiconductor的董事，曾在1995-2009，担任半导体公司Cirrus Logic的董事。他是Electronic Design Automation Consortium的副主席，并曾担任过2届主席，每届任期5年。他是Semiconductor Technical Advisory Committee of the Department of Commerce的委员，也是Computer and Business Equipment Manufacturers'Association （CBEMA）、SEMI-Sematech/SISA （半导体供应商委员会）、University of Michigan National Advisory Council、Lewis and Clark College 、SEMATECH的董事。加入Mentor之前，1987-1993，他曾担任Texas Instruments Incorporated的半导体业务的执行副总裁。他在Texas Instruments工作了21年，期间担任过许多行政管理方面的职务。他是固态照明和DVD的一项非常重要的发明专利的共同拥有人。
Walden C. Rhines from March 2020 to June 2025, Dr. Rhines served as President and Chief Executive Officer of Cornami, Inc., a fabless semiconductor company. Since 2015, Dr. Rhines has also served as a member of the board of directors and as chair of the compensation committee of Qorvo, Inc. (Nasdaq: QRVO), a semiconductor company, and its chairman since November 2023. He served as a member of the board of directors of PTK Acquisition Corp. (NYSE: PTK), a special purpose acquisition company from July 2020 until September 2021 and served on its audit, nominating and compensation committees. From October 1993 to March 2017, Dr. Rhines served as President and Chief Executive Officer of Mentor Graphics Corporation, an EDA company, and chairman of its board of directors from 2000 until its acquisition by Siemens AG in March 2017, pursuant to which the company was renamed Mentor Graphics, a Siemens Biness. Following the acquisition, Dr. Rhines served as President and Chief Executive Officer of Siemens EDA (formerly Mentor Graphics, a Siemens Biness), from March 2017 to October 2018, after which he served as its Chief Executive Officer Emerit until September 2020. - Walden C. Rhines，2000年以来，担任本公司的董事长、首席执行官；1993-2000，担任本公司的总裁、首席执行官。他目前是半导体公司TriQuint Semiconductor的董事，曾在1995-2009，担任半导体公司Cirrus Logic的董事。他是Electronic Design Automation Consortium的副主席，并曾担任过2届主席，每届任期5年。他是Semiconductor Technical Advisory Committee of the Department of Commerce的委员，也是Computer and Business Equipment Manufacturers'Association （CBEMA）、SEMI-Sematech/SISA （半导体供应商委员会）、University of Michigan National Advisory Council、Lewis and Clark College 、SEMATECH的董事。加入Mentor之前，1987-1993，他曾担任Texas Instruments Incorporated的半导体业务的执行副总裁。他在Texas Instruments工作了21年，期间担任过许多行政管理方面的职务。他是固态照明和DVD的一项非常重要的发明专利的共同拥有人。
- Walden C. Rhines from March 2020 to June 2025, Dr. Rhines served as President and Chief Executive Officer of Cornami, Inc., a fabless semiconductor company. Since 2015, Dr. Rhines has also served as a member of the board of directors and as chair of the compensation committee of Qorvo, Inc. (Nasdaq: QRVO), a semiconductor company, and its chairman since November 2023. He served as a member of the board of directors of PTK Acquisition Corp. (NYSE: PTK), a special purpose acquisition company from July 2020 until September 2021 and served on its audit, nominating and compensation committees. From October 1993 to March 2017, Dr. Rhines served as President and Chief Executive Officer of Mentor Graphics Corporation, an EDA company, and chairman of its board of directors from 2000 until its acquisition by Siemens AG in March 2017, pursuant to which the company was renamed Mentor Graphics, a Siemens Biness. Following the acquisition, Dr. Rhines served as President and Chief Executive Officer of Siemens EDA (formerly Mentor Graphics, a Siemens Biness), from March 2017 to October 2018, after which he served as its Chief Executive Officer Emerit until September 2020.
- Robert A. Bruggeworth
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Robert A. Bruggeworth，曾担任Qorvo, Inc.自2013年12月Qorvo公司成立以来，担任总裁兼首席执行官和董事。在成为Qorvo的董事之前，他从2003年1月到2015年1月担任RFMD的总裁兼首席执行官和董事，此前从1999年9月开始担任RFMD的多个高级管理职位。从1983年7月到1999年4月，他在AMP Inc.（现为TE Connectivity LTD）（电气和电子连接设备供应商）担任多个制造和工程职位，最近担任全球计算机和消费电子部门副总裁，总部设在香港。自2007年以来，Bruggeworth先生一直担任MSA Safety Incorporated的董事会成员，包括自2017年5月以来担任首席独立董事，MSA Safety Incorporated是一家公开上市的全球领导者，从事保护人员和设施基础设施的安全产品的开发、制造和供应。自2022年11月以来，他一直担任Seagate Technology Holdings plc（存储解决方案的公开交易提供商）的董事会成员。Bruggeworth先生于2021年担任半导体行业协会主席，并于2020年担任副主席。
Robert A. Bruggeworth,has served as Qorvo, Inc. President and Chief Executive Officer and as a director since Qorvo's incorporation in December 2013. Prior to becoming a director of Qorvo, he was RFMD's President and Chief Executive Officer and a director from January 2003 until January 2015, having previously served in several senior management positions at RFMD beginning in September 1999. From July 1983 to April 1999, Mr. Bruggeworth held several manufacturing and engineering positions at AMP Inc. (now TE Connectivity LTD), a supplier of electrical and electronic connection devices, most recently as Divisional Vice President of Global Computer and Consumer Electronics based in Hong Kong. Since 2007, Mr. Bruggeworth has served on the board of directors, including as lead independent director since May 2017, of MSA Safety Incorporated, a publicly traded global leader in the development, manufacture and supply of safety products that protect people and facility infrastructures. Since November 2022, Mr. Bruggeworth has served on the board of directors of Seagate Technology Holdings plc, a publicly traded provider of storage solutions. Mr. Bruggeworth served as the Chair of the Semiconductor Industry Association in 2021 and served as its Vice Chair in 2020. - Robert A. Bruggeworth，曾担任Qorvo, Inc.自2013年12月Qorvo公司成立以来，担任总裁兼首席执行官和董事。在成为Qorvo的董事之前，他从2003年1月到2015年1月担任RFMD的总裁兼首席执行官和董事，此前从1999年9月开始担任RFMD的多个高级管理职位。从1983年7月到1999年4月，他在AMP Inc.（现为TE Connectivity LTD）（电气和电子连接设备供应商）担任多个制造和工程职位，最近担任全球计算机和消费电子部门副总裁，总部设在香港。自2007年以来，Bruggeworth先生一直担任MSA Safety Incorporated的董事会成员，包括自2017年5月以来担任首席独立董事，MSA Safety Incorporated是一家公开上市的全球领导者，从事保护人员和设施基础设施的安全产品的开发、制造和供应。自2022年11月以来，他一直担任Seagate Technology Holdings plc（存储解决方案的公开交易提供商）的董事会成员。Bruggeworth先生于2021年担任半导体行业协会主席，并于2020年担任副主席。
- Robert A. Bruggeworth,has served as Qorvo, Inc. President and Chief Executive Officer and as a director since Qorvo's incorporation in December 2013. Prior to becoming a director of Qorvo, he was RFMD's President and Chief Executive Officer and a director from January 2003 until January 2015, having previously served in several senior management positions at RFMD beginning in September 1999. From July 1983 to April 1999, Mr. Bruggeworth held several manufacturing and engineering positions at AMP Inc. (now TE Connectivity LTD), a supplier of electrical and electronic connection devices, most recently as Divisional Vice President of Global Computer and Consumer Electronics based in Hong Kong. Since 2007, Mr. Bruggeworth has served on the board of directors, including as lead independent director since May 2017, of MSA Safety Incorporated, a publicly traded global leader in the development, manufacture and supply of safety products that protect people and facility infrastructures. Since November 2022, Mr. Bruggeworth has served on the board of directors of Seagate Technology Holdings plc, a publicly traded provider of storage solutions. Mr. Bruggeworth served as the Chair of the Semiconductor Industry Association in 2021 and served as its Vice Chair in 2020.
- John R. Harding
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John R. Harding在2006年11月被任命为董事。Harding先生是eSilicon Corporation的联合发起人和董事长，总裁和首席执行官，这是一家私人控股公司，为宽泛和持续增长的大小企业组合设计和生产复杂的定制的芯片。在2000年5月开始服务于eSilicon Corporation之前，Harding先生担任上市的Cadence Design Systems总裁，首席执行官和董事，此公司被他之前的雇主Cooper & Chyan Technology收购。Harding先生在Zycad Corporation担任一系列高级管理职务，他的职业生涯包括在TXL和 IBM Corporation的职务。Harding先生也担任Drew University和Indiana University IU的领导职务，在那他是理事会副主席，IU的School of Public and Environmental Affairs Advisory Board的成员。另外，Harding先生目前担任AMD的董事，也担任the U.S. Council on Competitiveness指导委员会的成员，是前National Academies' Committee的成员，负责软件，美国经济的增长和未来。在2012年，Harding先生再次被选为Global Semiconductor Alliance董事会的价值链生产的负责人，这个职位他从2010年开始任职。Harding先生是定期的国际演说家，话题涉及创新，企业家和半导体趋势和政策。
John R. Harding,has served on the Board of Directors since January 2015. From 2006 until 2015, he served as a director of RFMD. Since January 2020, Mr. Harding has served as a consultant in the fabless semiconductor design and manufacturing field as the General Partner of Harding Partners, LP. Mr. Harding co-founded eSilicon Corporation, a privately held company that designed and manufactured complex, custom chips for a broad portfolio of large and small firms. He served as President and Chief Executive Officer of eSilicon from its inception in May 2000 until it was acquired by Inphi Corporation in January 2020. Before starting eSilicon Corporation, Mr. Harding served as President, Chief Executive Officer and a director of publicly traded Cadence Design Systems, Inc., which acquired his former employer, Cooper & Chyan Technology, Inc. Mr. Harding held a variety of senior management positions at Zycad Corporation, and his career also includes positions with TXL and IBM Corporation. From 2012 to 2016, Mr. Harding served on the board of directors of Advanced Micro Devices, Inc. Mr. Harding has also held leadership roles at Drew University, where he was Vice Chairman of the Board of Trustees, and Indiana University, where he was a member of the Advisory Board for the School of Public and Environmental Affairs. In addition, Mr. Harding served as a member of the Steering Committee at the U.S. Council on Competitiveness and was a former member of the National Academies Committee for Software, Growth and the Future of the U.S. Economy. From 2004 to 2020, Mr. Harding served as a member of the board of directors of the Global Semiconductor Alliance. Since August 2022, Mr. Harding served as a director and Chair of the Board of Meta Materials Inc., a publicly traded developer of high-performance materials and nanocomposite, and since April 2021, as a director of SandFirst, Inc., an Electronic Design Automation (EDA) company. He is a frequent international speaker on the topics of innovation, entrepreneurship and semiconductor trends and policies. - John R. Harding在2006年11月被任命为董事。Harding先生是eSilicon Corporation的联合发起人和董事长，总裁和首席执行官，这是一家私人控股公司，为宽泛和持续增长的大小企业组合设计和生产复杂的定制的芯片。在2000年5月开始服务于eSilicon Corporation之前，Harding先生担任上市的Cadence Design Systems总裁，首席执行官和董事，此公司被他之前的雇主Cooper & Chyan Technology收购。Harding先生在Zycad Corporation担任一系列高级管理职务，他的职业生涯包括在TXL和 IBM Corporation的职务。Harding先生也担任Drew University和Indiana University IU的领导职务，在那他是理事会副主席，IU的School of Public and Environmental Affairs Advisory Board的成员。另外，Harding先生目前担任AMD的董事，也担任the U.S. Council on Competitiveness指导委员会的成员，是前National Academies' Committee的成员，负责软件，美国经济的增长和未来。在2012年，Harding先生再次被选为Global Semiconductor Alliance董事会的价值链生产的负责人，这个职位他从2010年开始任职。Harding先生是定期的国际演说家，话题涉及创新，企业家和半导体趋势和政策。
- John R. Harding,has served on the Board of Directors since January 2015. From 2006 until 2015, he served as a director of RFMD. Since January 2020, Mr. Harding has served as a consultant in the fabless semiconductor design and manufacturing field as the General Partner of Harding Partners, LP. Mr. Harding co-founded eSilicon Corporation, a privately held company that designed and manufactured complex, custom chips for a broad portfolio of large and small firms. He served as President and Chief Executive Officer of eSilicon from its inception in May 2000 until it was acquired by Inphi Corporation in January 2020. Before starting eSilicon Corporation, Mr. Harding served as President, Chief Executive Officer and a director of publicly traded Cadence Design Systems, Inc., which acquired his former employer, Cooper & Chyan Technology, Inc. Mr. Harding held a variety of senior management positions at Zycad Corporation, and his career also includes positions with TXL and IBM Corporation. From 2012 to 2016, Mr. Harding served on the board of directors of Advanced Micro Devices, Inc. Mr. Harding has also held leadership roles at Drew University, where he was Vice Chairman of the Board of Trustees, and Indiana University, where he was a member of the Advisory Board for the School of Public and Environmental Affairs. In addition, Mr. Harding served as a member of the Steering Committee at the U.S. Council on Competitiveness and was a former member of the National Academies Committee for Software, Growth and the Future of the U.S. Economy. From 2004 to 2020, Mr. Harding served as a member of the board of directors of the Global Semiconductor Alliance. Since August 2022, Mr. Harding served as a director and Chair of the Board of Meta Materials Inc., a publicly traded developer of high-performance materials and nanocomposite, and since April 2021, as a director of SandFirst, Inc., an Electronic Design Automation (EDA) company. He is a frequent international speaker on the topics of innovation, entrepreneurship and semiconductor trends and policies.
- Roderick D. Nelson
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Roderick D. Nelson于2012年8月成为TriQuint的董事，他在电子通信行业有超过25年的从业经历，从AT&T Wireless到许多新兴企业。从2009年开始他开始担任Tritech Sales and Services, LLC的联合创始人和负责人，这是一家战略产品、业务开发和销售的咨询公司。他曾担任过位于华盛顿州雷德蒙的AT&T Wireless Services的执行副总裁兼首席技术官，领导技术开发团队，负责美国第一个3G网络的开发和部署。在他的职业生涯中，Nelson先生与国内和国际的创造3G规格和标准的监管机构密切合作。他也是一家私人控股移动公司Aegis Mobility, Inc.的董事会成员。Nelson先生获得了 University of Minnesota的电子工程学理学学士学位，是众多无线通信方面的专利发明者，他给董事会及其委员会带来了他在无线和3G方面丰富的经验。
Roderick D. Nelson,has served on the Board of Directors since January 2015. From 2012 until 2015, he served as a director of TriQuint. An expert in wireless technology, in 2022 Mr. Nelson founded and is principal of Nelson Technology Partners, Inc., providing strategic and operational advice to communications companies. Since 2009, he has been the co-founder and principal of Tritech Sales and Services, LLC, a strategic product, business development and sales function consulting firm. In 2017, he co-founded Geoverse, LLC, a company which designs, deploys and manages in-building cellular LTE systems, and served as its Chief Executive Officer from June 2018 through April 2022. Mr. Nelson served as the Chief Technology Officer for Globetouch, Inc., a privately held global provider of 3G and LTE mobile broadband services for connected devices and IoT applications, from January 2015 to August 2017. He served as Executive Vice President and Chief Technology Officer of AT&T Wireless Services where, over a twenty-year career, he led the Technology Development Group responsible for the development and deployment of the first 3G networks in the United States. During his career, Mr. Nelson has worked closely with both national and international regulators and standards bodies on the creation of wireless specifications and standards. Mr. Nelson holds numerous patents covering broad and fundamental aspects of wireless communications. - Roderick D. Nelson于2012年8月成为TriQuint的董事，他在电子通信行业有超过25年的从业经历，从AT&T Wireless到许多新兴企业。从2009年开始他开始担任Tritech Sales and Services, LLC的联合创始人和负责人，这是一家战略产品、业务开发和销售的咨询公司。他曾担任过位于华盛顿州雷德蒙的AT&T Wireless Services的执行副总裁兼首席技术官，领导技术开发团队，负责美国第一个3G网络的开发和部署。在他的职业生涯中，Nelson先生与国内和国际的创造3G规格和标准的监管机构密切合作。他也是一家私人控股移动公司Aegis Mobility, Inc.的董事会成员。Nelson先生获得了 University of Minnesota的电子工程学理学学士学位，是众多无线通信方面的专利发明者，他给董事会及其委员会带来了他在无线和3G方面丰富的经验。
- Roderick D. Nelson,has served on the Board of Directors since January 2015. From 2012 until 2015, he served as a director of TriQuint. An expert in wireless technology, in 2022 Mr. Nelson founded and is principal of Nelson Technology Partners, Inc., providing strategic and operational advice to communications companies. Since 2009, he has been the co-founder and principal of Tritech Sales and Services, LLC, a strategic product, business development and sales function consulting firm. In 2017, he co-founded Geoverse, LLC, a company which designs, deploys and manages in-building cellular LTE systems, and served as its Chief Executive Officer from June 2018 through April 2022. Mr. Nelson served as the Chief Technology Officer for Globetouch, Inc., a privately held global provider of 3G and LTE mobile broadband services for connected devices and IoT applications, from January 2015 to August 2017. He served as Executive Vice President and Chief Technology Officer of AT&T Wireless Services where, over a twenty-year career, he led the Technology Development Group responsible for the development and deployment of the first 3G networks in the United States. During his career, Mr. Nelson has worked closely with both national and international regulators and standards bodies on the creation of wireless specifications and standards. Mr. Nelson holds numerous patents covering broad and fundamental aspects of wireless communications.
高管简历
中英对照 | 中文 | 英文- Gina B. Harrison
Gina B. Harrison，她一直是副总裁和公司总会计师（2015年11月以来）。她是注册会计师，拥有25年是企业和公共会计领导经验。她于2000年加入RFMD公司，担任财务报告职务，并不断被提拔（直到2005年3月）。她曾担任RFMD公司的财务报告和萨班斯-奥克斯利法案合规主管（2005年4月至2014年12月），也曾担任Qorvo公司的一些职务（2015年1月至2015年10月）。加入RFMD公司之前，她曾担任Sara Lee Hosiery（1992年至2000年）、Price Waterhouse（1990年至1992年）的财务和会计职务。
Gina B. Harrison,has served as Vice President and Corporate Controller since November 2015. She is a certified public accountant with over 30 years of progressive leadership experience in corporate and public accounting. She joined RFMD in 2000 and held roles of increasing responsibility in financial reporting through March 2005. She served as RFMD's Director of Financial Reporting and Sarbanes-Oxley Compliance from April 2005 to December 2014 and served in that same role at Qorvo from January 2015 to October 2015. Prior to joining RFMD, Ms. Harrison held financial and accounting positions at Sara Lee Hosiery from 1992 to 2000 and at Price Waterhouse from 1990 to 1992.- Gina B. Harrison，她一直是副总裁和公司总会计师（2015年11月以来）。她是注册会计师，拥有25年是企业和公共会计领导经验。她于2000年加入RFMD公司，担任财务报告职务，并不断被提拔（直到2005年3月）。她曾担任RFMD公司的财务报告和萨班斯-奥克斯利法案合规主管（2005年4月至2014年12月），也曾担任Qorvo公司的一些职务（2015年1月至2015年10月）。加入RFMD公司之前，她曾担任Sara Lee Hosiery（1992年至2000年）、Price Waterhouse（1990年至1992年）的财务和会计职务。
- Gina B. Harrison,has served as Vice President and Corporate Controller since November 2015. She is a certified public accountant with over 30 years of progressive leadership experience in corporate and public accounting. She joined RFMD in 2000 and held roles of increasing responsibility in financial reporting through March 2005. She served as RFMD's Director of Financial Reporting and Sarbanes-Oxley Compliance from April 2005 to December 2014 and served in that same role at Qorvo from January 2015 to October 2015. Prior to joining RFMD, Ms. Harrison held financial and accounting positions at Sara Lee Hosiery from 1992 to 2000 and at Price Waterhouse from 1990 to 1992.
- Paul J. Fego
Paul J. Fego，自2022年7月起担任全球运营高级副总裁兼总裁，此前他自2018年7月起担任全球运营公司副总裁。从2005年1月到2017年8月，他担任Texas Instruments（全球领先的半导体和技术公司）的全球制造技术和制造集团的副总裁兼经理，在那里他管理其在9个国家的所有晶圆制造、组装和测试业务。此前，Fego先生在Photronics, Inc.（为制造半导体、平板显示器和其他电子元件的公司提供光掩膜解决方案的全球领导者）担任多个职位，责任越来越大，最近从2002年3月到2005年1月担任总裁兼首席运营官。在1996年加入Photronics担任首席运营官之前，他曾担任ST Microelectronics Inc.的运营总监（1989年9月至1996年11月）。在加入ST Microelectronics之前，他曾担任Texas Instruments的多个职位（1980年至1989年）。
Paul J. Fego,has served as Senior Vice President and President of Global Operations since July 2022, prior to which he served as Corporate Vice President of Global Operations since July 2018. From January 2005 through August 2017, he served as Vice President and Manager, Worldwide Manufacturing Technology & Manufacturing Group of Texas Instruments, a leading global semiconductor and technology company, where he managed all of its wafer fabrication, assembly and test operations in nine countries. Previously, Mr. Fego served in several positions of increasing responsibility at Photronics, Inc., a global leader in photomask solutions for companies that manufacture semiconductors, flat panel displays and other electronic components, most recently as President and Chief Operating Officer from March 2002 to January 2005. Prior to joining Photronics to become its Chief Operating Officer in 1996, Mr. Fego served as Operations Director at ST Microelectronics Inc. from September 1989 to November 1996. Prior to joining ST Microelectronics, Mr. Fego served in various positions with Texas Instruments from 1980 to 1989.- Paul J. Fego，自2022年7月起担任全球运营高级副总裁兼总裁，此前他自2018年7月起担任全球运营公司副总裁。从2005年1月到2017年8月，他担任Texas Instruments（全球领先的半导体和技术公司）的全球制造技术和制造集团的副总裁兼经理，在那里他管理其在9个国家的所有晶圆制造、组装和测试业务。此前，Fego先生在Photronics, Inc.（为制造半导体、平板显示器和其他电子元件的公司提供光掩膜解决方案的全球领导者）担任多个职位，责任越来越大，最近从2002年3月到2005年1月担任总裁兼首席运营官。在1996年加入Photronics担任首席运营官之前，他曾担任ST Microelectronics Inc.的运营总监（1989年9月至1996年11月）。在加入ST Microelectronics之前，他曾担任Texas Instruments的多个职位（1980年至1989年）。
- Paul J. Fego,has served as Senior Vice President and President of Global Operations since July 2022, prior to which he served as Corporate Vice President of Global Operations since July 2018. From January 2005 through August 2017, he served as Vice President and Manager, Worldwide Manufacturing Technology & Manufacturing Group of Texas Instruments, a leading global semiconductor and technology company, where he managed all of its wafer fabrication, assembly and test operations in nine countries. Previously, Mr. Fego served in several positions of increasing responsibility at Photronics, Inc., a global leader in photomask solutions for companies that manufacture semiconductors, flat panel displays and other electronic components, most recently as President and Chief Operating Officer from March 2002 to January 2005. Prior to joining Photronics to become its Chief Operating Officer in 1996, Mr. Fego served as Operations Director at ST Microelectronics Inc. from September 1989 to November 1996. Prior to joining ST Microelectronics, Mr. Fego served in various positions with Texas Instruments from 1980 to 1989.
- Grant A. Brown
Grant A. Brown自2022年4月起担任临时首席财务官，自2018年10月起担任财政部副总裁。他负责Qorvo的财务、投资者关系和监管报告。此外，他还担任Qorvo, Inc.业务转型副总裁，负责监督Qorvo的信息技术事务。在此之前，他曾担任Qorvo的企业财务规划与分析总监。他也曾担任Qorvo的业务单元总监和战略营销总监。在成立Qorvo之前，他曾担任TriQuint Semiconductor的投资者关系董事和财务规划与分析经理。他在斯坦福大学获得工业工程（现为管理科学与工程）学士学位后，开始了他在资本市场的职业生涯。他目前是CFA特许持有人。
Grant A. Brown,has served as Senior Vice President and Chief Financial Officer since August 29, 2022, after having served as Qorvo, Inc. interim Chief Financial Officer since April 2022. He is responsible for finance, investor relations, regulatory reporting, corporate development, mergers and acquisitions and information technology at Qorvo. Previously, Mr. Brown served as the Company's Vice President of Treasury from October 2018. Before that, he served as Qorvo's Director of Corporate Financial Planning & Analysis. Mr. Brown has also served as Business Unit Controller and Director of Strategic Marketing at Qorvo. Prior to the formation of Qorvo, he served as Director, Investor Relations, and Manager, Financial Planning & Analysis, at TriQuint. He began his career working in the capital markets after receiving a Bachelor of Science degree in Industrial Engineering (now Management Science and Engineering) from Stanford University. Mr. Brown is currently a CFA charter holder.- Grant A. Brown自2022年4月起担任临时首席财务官，自2018年10月起担任财政部副总裁。他负责Qorvo的财务、投资者关系和监管报告。此外，他还担任Qorvo, Inc.业务转型副总裁，负责监督Qorvo的信息技术事务。在此之前，他曾担任Qorvo的企业财务规划与分析总监。他也曾担任Qorvo的业务单元总监和战略营销总监。在成立Qorvo之前，他曾担任TriQuint Semiconductor的投资者关系董事和财务规划与分析经理。他在斯坦福大学获得工业工程（现为管理科学与工程）学士学位后，开始了他在资本市场的职业生涯。他目前是CFA特许持有人。
- Grant A. Brown,has served as Senior Vice President and Chief Financial Officer since August 29, 2022, after having served as Qorvo, Inc. interim Chief Financial Officer since April 2022. He is responsible for finance, investor relations, regulatory reporting, corporate development, mergers and acquisitions and information technology at Qorvo. Previously, Mr. Brown served as the Company's Vice President of Treasury from October 2018. Before that, he served as Qorvo's Director of Corporate Financial Planning & Analysis. Mr. Brown has also served as Business Unit Controller and Director of Strategic Marketing at Qorvo. Prior to the formation of Qorvo, he served as Director, Investor Relations, and Manager, Financial Planning & Analysis, at TriQuint. He began his career working in the capital markets after receiving a Bachelor of Science degree in Industrial Engineering (now Management Science and Engineering) from Stanford University. Mr. Brown is currently a CFA charter holder.
- Philip J. Chesley
Philip J. Chesley于2021年11月加入Qorvo，担任Qorvo副总裁兼Qorvo基础设施和国防产品IDP总裁。2017年2月至2021年10月，他曾担任Renesas Electronics（一家先进半导体解决方案的领先供应商）的工业和通信业务部门副总裁兼总经理，在那里他管理了亚洲和美国的超过500名工程师，业务开发射频，光学，工业电源/电机控制，以及军事和辐射硬化模拟产品到5G RF无线基础设施，光通信，工业电源管理和辐射强化了卫星市场。从2004年1月到2017年2月，他在Intersil Corporation（模拟、混合信号和电源管理半导体的领导者，在被Renesas Electronics收购之前）担任多个职位，责任越来越大，最近担任汽车、Mil/Aero和模拟产品集团的高级副总裁兼总经理。
Philip J. Chesley,has served as Senior Vice President and President of High Performance Analog since July 2022, prior to which he served as Corporate Vice President and President of Qorvo's Infrastructure and Defense Products (IDP) since joining Qorvo in November 2021. From February 2017 through October 2021, Mr. Chesley served as Vice President and General Manager, Industrial and Communications Business Unit at Renesas Electronics, a leading supplier of advanced semiconductor solutions, where he managed over 500 engineers across Asia and the United States in businesses developing RF, optical, industrial power / motor control, and military and radiation-hardened analog products into 5G RF wireless infrastructure, optical communications, industrial power management, and radiation-hardened satellite markets. From January 2004 to February 2017, Mr. Chesley served in several positions of increasing responsibility at Intersil Corporation, a leader in analog, mixed-signal and power management semiconductors prior to its acquisition by Renesas Electronics, most recently as Senior Vice President and General Manager of the Automotive, Mil/Aero and Analog Product Group. Mr. Chesley earned an MBA from Duke University's Fuqua School of Management and a Bachelor of Science degree from Brigham Young University.- Philip J. Chesley于2021年11月加入Qorvo，担任Qorvo副总裁兼Qorvo基础设施和国防产品IDP总裁。2017年2月至2021年10月，他曾担任Renesas Electronics（一家先进半导体解决方案的领先供应商）的工业和通信业务部门副总裁兼总经理，在那里他管理了亚洲和美国的超过500名工程师，业务开发射频，光学，工业电源/电机控制，以及军事和辐射硬化模拟产品到5G RF无线基础设施，光通信，工业电源管理和辐射强化了卫星市场。从2004年1月到2017年2月，他在Intersil Corporation（模拟、混合信号和电源管理半导体的领导者，在被Renesas Electronics收购之前）担任多个职位，责任越来越大，最近担任汽车、Mil/Aero和模拟产品集团的高级副总裁兼总经理。
- Philip J. Chesley,has served as Senior Vice President and President of High Performance Analog since July 2022, prior to which he served as Corporate Vice President and President of Qorvo's Infrastructure and Defense Products (IDP) since joining Qorvo in November 2021. From February 2017 through October 2021, Mr. Chesley served as Vice President and General Manager, Industrial and Communications Business Unit at Renesas Electronics, a leading supplier of advanced semiconductor solutions, where he managed over 500 engineers across Asia and the United States in businesses developing RF, optical, industrial power / motor control, and military and radiation-hardened analog products into 5G RF wireless infrastructure, optical communications, industrial power management, and radiation-hardened satellite markets. From January 2004 to February 2017, Mr. Chesley served in several positions of increasing responsibility at Intersil Corporation, a leader in analog, mixed-signal and power management semiconductors prior to its acquisition by Renesas Electronics, most recently as Senior Vice President and General Manager of the Automotive, Mil/Aero and Analog Product Group. Mr. Chesley earned an MBA from Duke University's Fuqua School of Management and a Bachelor of Science degree from Brigham Young University.
- Frank P. Stewart
Frank P. Stewart，自2022年7月起担任Advanced Cellular的高级副总裁兼总裁。他负责Advanced Cellular产品营销、研发、设计中心、定价、销售和专业销售支持。他曾担任Qorvo移动产品射频解决方案业务部的总经理。在2015年1月合并成立Qorvo之前，他是蜂窝产品的营销总监，在此之前是RFMD的GPS产品的高级产品线经理。他于2001年加入RFMD，担任RFMD诺基亚产品线的客户经理，之前担任战略营销经理。他获得了Grove City College的BSEE学位和Duke University's Fuqua School of Management的MBA学位。
Frank P. Stewart,has served as Senior Vice President and President of Advanced Cellular since July 2022. He is responsible for Advanced Cellular product marketing, R&D, design centers, pricing, sales and specialized sales support. Mr. Stewart was previously general manager of the RF Solutions Business Unit within Qorvo's Mobile Products. Prior to the merger to form Qorvo in January 2015, Mr. Stewart was director of Marketing for Cellular Products and prior to this was senior Product Line manager for GPS Products at RFMD. Mr. Stewart joined RFMD in 2001 and served as RFMD's account manager for the Nokia Product Line, and previously as manager of Strategic Marketing. He earned a BSEE from Grove City College and an MBA from Duke University's Fuqua School of Management.- Frank P. Stewart，自2022年7月起担任Advanced Cellular的高级副总裁兼总裁。他负责Advanced Cellular产品营销、研发、设计中心、定价、销售和专业销售支持。他曾担任Qorvo移动产品射频解决方案业务部的总经理。在2015年1月合并成立Qorvo之前，他是蜂窝产品的营销总监，在此之前是RFMD的GPS产品的高级产品线经理。他于2001年加入RFMD，担任RFMD诺基亚产品线的客户经理，之前担任战略营销经理。他获得了Grove City College的BSEE学位和Duke University's Fuqua School of Management的MBA学位。
- Frank P. Stewart,has served as Senior Vice President and President of Advanced Cellular since July 2022. He is responsible for Advanced Cellular product marketing, R&D, design centers, pricing, sales and specialized sales support. Mr. Stewart was previously general manager of the RF Solutions Business Unit within Qorvo's Mobile Products. Prior to the merger to form Qorvo in January 2015, Mr. Stewart was director of Marketing for Cellular Products and prior to this was senior Product Line manager for GPS Products at RFMD. Mr. Stewart joined RFMD in 2001 and served as RFMD's account manager for the Nokia Product Line, and previously as manager of Strategic Marketing. He earned a BSEE from Grove City College and an MBA from Duke University's Fuqua School of Management.
- Robert A. Bruggeworth
Robert A. Bruggeworth，曾担任Qorvo, Inc.自2013年12月Qorvo公司成立以来，担任总裁兼首席执行官和董事。在成为Qorvo的董事之前，他从2003年1月到2015年1月担任RFMD的总裁兼首席执行官和董事，此前从1999年9月开始担任RFMD的多个高级管理职位。从1983年7月到1999年4月，他在AMP Inc.（现为TE Connectivity LTD）（电气和电子连接设备供应商）担任多个制造和工程职位，最近担任全球计算机和消费电子部门副总裁，总部设在香港。自2007年以来，Bruggeworth先生一直担任MSA Safety Incorporated的董事会成员，包括自2017年5月以来担任首席独立董事，MSA Safety Incorporated是一家公开上市的全球领导者，从事保护人员和设施基础设施的安全产品的开发、制造和供应。自2022年11月以来，他一直担任Seagate Technology Holdings plc（存储解决方案的公开交易提供商）的董事会成员。Bruggeworth先生于2021年担任半导体行业协会主席，并于2020年担任副主席。
Robert A. Bruggeworth,has served as Qorvo, Inc. President and Chief Executive Officer and as a director since Qorvo's incorporation in December 2013. Prior to becoming a director of Qorvo, he was RFMD's President and Chief Executive Officer and a director from January 2003 until January 2015, having previously served in several senior management positions at RFMD beginning in September 1999. From July 1983 to April 1999, Mr. Bruggeworth held several manufacturing and engineering positions at AMP Inc. (now TE Connectivity LTD), a supplier of electrical and electronic connection devices, most recently as Divisional Vice President of Global Computer and Consumer Electronics based in Hong Kong. Since 2007, Mr. Bruggeworth has served on the board of directors, including as lead independent director since May 2017, of MSA Safety Incorporated, a publicly traded global leader in the development, manufacture and supply of safety products that protect people and facility infrastructures. Since November 2022, Mr. Bruggeworth has served on the board of directors of Seagate Technology Holdings plc, a publicly traded provider of storage solutions. Mr. Bruggeworth served as the Chair of the Semiconductor Industry Association in 2021 and served as its Vice Chair in 2020.- Robert A. Bruggeworth，曾担任Qorvo, Inc.自2013年12月Qorvo公司成立以来，担任总裁兼首席执行官和董事。在成为Qorvo的董事之前，他从2003年1月到2015年1月担任RFMD的总裁兼首席执行官和董事，此前从1999年9月开始担任RFMD的多个高级管理职位。从1983年7月到1999年4月，他在AMP Inc.（现为TE Connectivity LTD）（电气和电子连接设备供应商）担任多个制造和工程职位，最近担任全球计算机和消费电子部门副总裁，总部设在香港。自2007年以来，Bruggeworth先生一直担任MSA Safety Incorporated的董事会成员，包括自2017年5月以来担任首席独立董事，MSA Safety Incorporated是一家公开上市的全球领导者，从事保护人员和设施基础设施的安全产品的开发、制造和供应。自2022年11月以来，他一直担任Seagate Technology Holdings plc（存储解决方案的公开交易提供商）的董事会成员。Bruggeworth先生于2021年担任半导体行业协会主席，并于2020年担任副主席。
- Robert A. Bruggeworth,has served as Qorvo, Inc. President and Chief Executive Officer and as a director since Qorvo's incorporation in December 2013. Prior to becoming a director of Qorvo, he was RFMD's President and Chief Executive Officer and a director from January 2003 until January 2015, having previously served in several senior management positions at RFMD beginning in September 1999. From July 1983 to April 1999, Mr. Bruggeworth held several manufacturing and engineering positions at AMP Inc. (now TE Connectivity LTD), a supplier of electrical and electronic connection devices, most recently as Divisional Vice President of Global Computer and Consumer Electronics based in Hong Kong. Since 2007, Mr. Bruggeworth has served on the board of directors, including as lead independent director since May 2017, of MSA Safety Incorporated, a publicly traded global leader in the development, manufacture and supply of safety products that protect people and facility infrastructures. Since November 2022, Mr. Bruggeworth has served on the board of directors of Seagate Technology Holdings plc, a publicly traded provider of storage solutions. Mr. Bruggeworth served as the Chair of the Semiconductor Industry Association in 2021 and served as its Vice Chair in 2020.
- Steven E. Creviston
Steven E. Creviston从2007年8月来担任Cellular Products Group或叫CPG的企业副总和总裁。从2002年5月到2007年8月期间，他担任CPG的企业副总，以无线产品被知道，直到2004年4月。他在1994年12月开始在RFMD的任职作为战略客户经理。从1997年5月到1999年5月，Creviston先生是客户管理的负责人，在1999年6月到2001年4月之间是产品线负责人，在2001年5月到2002年5月之间他是分部副总。
Steven E. Creviston,has served as Senior Vice President and President of Connectivity & Sensors since July 2022, prior to which he served as Corporate Vice President and President of Mobile Products since January 2015. Mr. Creviston served as Corporate Vice President and President of Cellular Products Group, or CPG, for RFMD from August 2007 to January 2015. From May 2002 to August 2007, he served as Corporate Vice President of CPG, which was known as Wireless Products until 2004, for RFMD. Prior to 2002, he held various positions of increasing responsibilities at RFMD. Mr. Creviston has served as a director of LightPath Technologies, Inc., a publicly traded designer, developer, manufacturer and distributor of optical components and assemblies, since March 2021.- Steven E. Creviston从2007年8月来担任Cellular Products Group或叫CPG的企业副总和总裁。从2002年5月到2007年8月期间，他担任CPG的企业副总，以无线产品被知道，直到2004年4月。他在1994年12月开始在RFMD的任职作为战略客户经理。从1997年5月到1999年5月，Creviston先生是客户管理的负责人，在1999年6月到2001年4月之间是产品线负责人，在2001年5月到2002年5月之间他是分部副总。
- Steven E. Creviston,has served as Senior Vice President and President of Connectivity & Sensors since July 2022, prior to which he served as Corporate Vice President and President of Mobile Products since January 2015. Mr. Creviston served as Corporate Vice President and President of Cellular Products Group, or CPG, for RFMD from August 2007 to January 2015. From May 2002 to August 2007, he served as Corporate Vice President of CPG, which was known as Wireless Products until 2004, for RFMD. Prior to 2002, he held various positions of increasing responsibilities at RFMD. Mr. Creviston has served as a director of LightPath Technologies, Inc., a publicly traded designer, developer, manufacturer and distributor of optical components and assemblies, since March 2021.